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SmallPads 42-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 64-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/lnk520.pdf SMD DIP Switch SPST Slide 7.62mm 300mil Three phase, Bridge, Rectifier, https://www.comchiptech.com/admin/files/product/SC35VB80S-G%20Thru506369.%20SC35VB160S-G%20RevB.pdf 4-lead dip package with missing pin 6 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 9.78x9.8mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 1x-dip-switch SPST , Piano, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 32-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf Power Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), LongPads 48-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils), https://wiki.wemos.cc/products:d1:d1_mini, https://c1.staticflickr.com/1/734/31400410271_f278b087db_z.jpg DIN rail adapter universal three M3 clearance holes Mounting Hole 5.5mm, no annular m5 din965 Mounting Hole 8.4mm, no annular, M2.5, DIN965 mounting hole 6.4mm m6 Mounting Hole 5mm, no annular m2 Mounting Hole 8.4mm, M8 mounting hole 3.2mm no annular m5 iso7380 Mounting Hole 6mm, no annular m6 iso7380 Mounting Hole 4mm, no annular mounting hole 2.2mm m2 iso7380 Mounting Hole 2.2mm, no annular, M2, DIN965 mounting hole 4.3mm no annular mounting hole 2.1mm no annular Mounting Hole 5.5mm, no annular m5 Mounting Hole 2.7mm, no annular, M4 mounting hole 2.2mm m2 din965 Mounting Hole 5.3mm, no annular, M3, ISO14580 mounting hole 4.3mm no annular mounting hole 6.4mm m6.

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