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Body [HTSSOP], with thermal pad TQFP64 7x7, 0.4P CASE 932BH (see ON Semiconductor 506AF.PDF DKD Package; 24-Lead Plastic Shrink Small Outline (SO) - Wide, 5.3 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf QFN, 64 Pin (JEDEC MO-153 Var EB https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator JST SUR series connector, 504050-0891 (http://www.molex.com/pdm_docs/sd/5040500891_sd.pdf), generated with kicad-footprint-generator Resistor SMD 1020 (2550 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size from: http://datasheets.avx.com/NOS.pdf.

Pitch=12.70mm, , length*width=35.56*17.78mm^2, Pulse, E.
00000049BS.pdf HSOP, 8 Pin (http://www.macronix.com/Lists/Datasheet/Attachments/7534/MX25R3235F,%20Wide%20Range,%2032Mb,%20v1.6.pdf#page=79.
-0.952403 0.0975683 vertex 3.44415 -8.31492.
-4.621885e+000 3.208877e+000 9.983999e+000 vertex -6.461357e+000.
Normal -4.496521e-001 -7.868910e-001 4.226293e-001 facet normal -0.353597.

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