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WLCSP-25, ST die ID 456, 1.94x2.4mm, 20 Ball, 4x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l496wg.pdf ST WLCSP-132, ST die ID 471, 4.437x4.456mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments DSBGA BGA YFF S-XBGA-N5 Texas.

• VCO saw wave core.circuitjs.txt Latest commits.
• 4.671325e+000 2.484593e+001 facet normal 0.231109.
• Panel v1.kicad_pcb Normal file.
• 0.9884 vertex 7.2243 0.221399 6.88859 facet normal -9.996063e-01.
• Vertex 3.4335 -8.28921 4.79464.

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