Labels Milestones
BackIpc_noLead_generator.py 44-Lead Plastic Thin Quad Flatpack No-Lead Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments DSBGA BGA Texas Instruments, DSBGA, area grid, NSMD pad definition Appendix A BGA 400 0.8 CLG400 CL400 Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=280, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed.
- -4.5363 21.833 vertex 0.996058 -6.9148 7.89166 facet.
- Size 15.2x10.6mm^2, drill diamater.
- Exposed pad 4.5x7mm (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-20-71/ Infineon SO.