Labels Milestones
BackModule, column spacing 22.86 mm (900 mils THT DIP DIL ZIF 7.62mm 300mil Socket LongPads 22-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), body size 9.78x9.8mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 1x-dip-switch SPST , Slide, row spacing 9.53 mm (375 mils 12-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils), body size 10.8x4.1mm DIP Switch SPST Slide 5.25mm 206mil JPin SMD 8x-dip-switch SPST Copal_CHS-08B, Slide, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf PowerIntegrations variant of TO-92), also known as TO-226, wide, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot519-1_po.pdf SSOP16: plastic shrink small outline package.
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