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BackHttps://toshiba.semicon-storage.com/ap-en/design-support/package/detail.TO-3P(N).html TO-3P-3 Horizontal RM 2.54mm TO-220F-4, Vertical, RM 2.54mm TO-247-4, Vertical, RM 1.7mm, Pentawatt, Multiwatt-5, see http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-to-220/to-220_5_05-08-1421_straight_lead.pdf TO-220-5 Vertical RM 1.7mm PentawattF- MultiwattF-5 TO-220F-5, Vertical, RM 2.54mm, IIPAK, I2PAK, see http://pdf.datasheetcatalog.com/datasheet/irf/iris4011.pdf TO-262-5 Vertical RM 0.9mm staggered type-2 TO-220-9 Horizontal RM 10.95mm SOT-93 TO-218-2, Vertical, RM 1.27mm, staggered type-1 TO-220F-4, Vertical, RM 2.54mm, staggered type-2 TO-220F-5 Vertical RM 5.475mm SOT-93 TO-218-3, Vertical, RM 2.54mm, IIPAK, I2PAK, see http://pdf.datasheetcatalog.com/datasheet/irf/iris4011.pdf TO-262-5 Vertical RM 1.7mm IIPAK I2PAK TO-262-3, Vertical, RM 5.08mm, see http://www.onsemi.com/pub/Collateral/FFPF10F150S-D.pdf TO-220F-2 Vertical RM 5.45mm TO-247-3, Vertical, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 2.54mm 10.16mm 400mil LongPads 5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 10.16mm 400mil Socket 3M 16-pin zero insertion force socket, through-hole, row spacing 7.62 mm (300 mils), LongPads 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 28-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, LongPads 40-lead though-hole mounted DIP package, row spacing 5.9 mm (232 mils), body size 10.8x24.42mm 9x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket 8-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils THT DIP DIL PDIP 2.54mm 7.62mm 300mil 3-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, LongPads 14-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, LongPads 64-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 18-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 8-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads THT DIP DIL PDIP 2.54mm 10.16mm 400mil Socket LongPads 4-lead though-hole mounted DIP package, row spacing 11.48 mm.
- -0.60884 -0.184688 0.771495 facet normal.
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- -0.0808324 0.0818475 0.993362 vertex -4.12613 4.97321 7.83559 facet.
- Header Only, Palladium Nickel (https://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F5767171%7FB2%7Fpdf%7FEnglish%7FENG_CD_5767171_B2.pdf%7F5767171-1#page=2 Molex.