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5.5A, Itrip=10.0A, http://www.bourns.com/docs/product-datasheets/mfrht.pdf PTC Resettable Fuse, Ihold = 4.0A, Itrip=6.8A, http://www.bourns.com/docs/Product-Datasheets/mfrg.pdf PTC Resettable Fuse, Ihold = 7.5A, Itrip=13.1A, http://www.bourns.com/docs/product-datasheets/mfrht.pdf PTC Resettable Fuse, Ihold = 10.0A, Itrip=18.5A, http://www.bourns.com/docs/product-datasheets/mfrht.pdf PTC Resettable Fuse, Ihold = 2.0A, Itrip=3.8A, http://www.bourns.com/docs/product-datasheets/mfrht.pdf PTC Resettable Fuse, Ihold = 13.0A, Itrip=24.0A, http://www.bourns.com/docs/product-datasheets/mfrht.pdf bourns ptc resettable fuse polyfuse MF-SM MF-SMHT Littelfuse, resettable fuse, PTC, polyswitch LVR100, Ih 1A http://www.littelfuse.com/~/media/electronics/datasheets/resettable_ptcs/littelfuse_ptc_lvr_catalog_datasheet.pdf.pdf LVR100 PTC resettable polyswitch Fuse, Littelfuse, 372, 8.5x8mm, https://www.littelfuse.com/~/media/electronics/datasheets/fuses/littelfuse_fuse_372_datasheet.pdf.pdf Fuse, TE5, Littelfuse/Wickmann, No. 460, No560, https://www.littelfuse.com/~/media/electronics/datasheets/fuse_holders/littelfuse_fuse_holder_559_560_datasheet.pdf.pdf Fuse Fuseholder ATO Blade littelfuse Pudenz 2 Pin (https://www.bourns.com/data/global/pdfs/TBU-CA.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 6 times 0.1 mm² wire, basic insulation, conductor diameter 0.9mm, outer diameter 4.4mm, size source Multi-Contact FLEXI-xV 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection, for a single 0.75 mm² wires, reinforced insulation, conductor diameter 1.25mm, outer diameter 2.7mm, size source Multi-Contact FLEXI-xV 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-148-02-xxx-DV-BE-A, 48 Pins per row (http://www.molex.com/pdm_docs/sd/431602102_sd.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.2mm, height 11.6, Wuerth electronics 9776040960 (https://katalog.we-online.com/em/datasheet/9776040960.pdf), generated with kicad-footprint-generator JST XH series connector, 505405-0970 (http://www.molex.com/pdm_docs/sd/5054050270_sd.pdf), generated with kicad-footprint-generator JST SUR series connector, B8P-VH (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator Hirose series connector, SM13B-GHS-TB (http://www.jst-mfg.com/product/pdf/eng/eGH.pdf), generated with kicad-footprint-generator Fuse SMD 1812 (4532 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size from: http://datasheets.avx.com/F72-F75.pdf), generated with kicad-footprint-generator Molex Pico-Clasp series connector, S03B-ZESK-2D (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Soldered wire connection, for 3 times outer diameter, generated with kicad-footprint-generator ipc_qfp_generator.py 64-Lead Plastic Thin Shrink Small-Outline Package, Body 3.0x3.0x0.8mm, Texas Instruments DSBGA BGA YZP R-XBGA-N8 Texas Instruments, DSBGA, area grid, YBJ0008 pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.35mm Pitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments, DSBGA, area grid, YZP, YZP0010, 1.86x1.36mm, 10 Ball, 3x4 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST TFBGA-225, 13.0x13.0mm, 225 Ball, 15x15 Layout, 0.8mm Pitch, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-bga/05081600_0_bga49.pdf https://www.analog.com/media/en/technical-documentation/product-information/assembly-considerations-for-umodule-bga-lga-package.pdf BGA 324 0.8 GateMate FPGA Maxim WLP-12, W121H2+1, 2.008x1.608mm, 12 Ball, 3x4 Layout, 0.5mm Pitch, https://www.diodes.com/assets/Datasheets/AP22913.pdf WLCSP-4, 0.64x0.64mm, 4 Ball, 2x2 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h725vg.pdf ST WLCSP-115, ST die ID 464, 2.58x3.07mm, 36 Ball, 6x6 Layout, 0.4mm Pitch, https://www.ti.com/lit/gpn/ina234 Texas Instruments, DSBGA, 1.36x1.86mm, 10 bump 3x4 (perimeter) array, NSMD pad definition Appendix A BGA 484 1 FB484 FBG484 FBV484 Artix-7, Kintex-7 and Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch.

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