Labels Milestones
BackOmron_A6H-6101, Slide, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 28-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 32-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket THT DIP DIL PDIP 2.54mm 15.24mm 600mil Socket 3M 14-pin zero insertion force socket, through-hole, row spacing 10.16 mm (400 mils), Socket.
- Nichicon, 8.0x5.4mm SMD capacitor, aluminum.
- Clearance8mm 18-lead surface-mounted (SMD) DIP package, row spacing.
- Wide, https://www.erni-x-press.com/de/downloads/kataloge/englische_kataloge/erni-din41612-iec60603-2-e.pdf DIN 41612 IEC.
- KingTek_DSHP10TJ, Slide, row spacing 9.53 mm (375.
- Connector, FH12-18S-0.5SH, 18 Pins per row.