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Strip, HLE-140-02-xxx-DV-BE-A, 40 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SOIC, 16 Pin (http://www.cypress.com/file/46236/download), generated with kicad-footprint-generator Hirose DF63 through hole, http://www.assmann-wsw.com/fileadmin/datasheets/ASS_0981_CO.pdf PLCC, 44 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/2512S.pdf#page=17), generated with kicad-footprint-generator Fuse SMD 2920 (7451 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: https://www.vishay.com/docs/20019/rcwe.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 32 Pin (https://www.espressif.com/sites/default/files/documentation/0a-esp8285_datasheet_en.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: A-41791-0007 example for new mpn: 39-29-4249, 12 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf.

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