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Back"Layer B.Paste" "Notes": "Layer F.Paste" "Notes": "Layer F.SilkS" "Notes": "Layer F.Mask" "Notes": "Layer F.Paste" "Notes": "Layer F.Cu" "Notes": "Layers L1/L2" "Notes": "Layer F.Cu" "Notes": "Layers L1/L2" "Notes": "Layer F.Paste" "Notes": "Layer F.Cu" "Notes": "Layers L1/L2" "Notes": "Layer F.Cu" "Notes": "Layers L1/L2" "Notes": "Layer F.SilkS" "Notes": "Layer F.Mask" "Notes": "Layer B.Paste" "Notes": "Layer B.Paste" "Notes": "Layer B.Cu" "Notes": "Layer F.Cu" "Notes": "Layers L1/L2" "Notes": "Layer B.Cu" "Notes": "Layer F.SilkS" "Notes": "Layer B.Mask" "Notes": "Layer F.SilkS" "Notes": "Layer F.Mask" "Notes": "Layer F.Mask" "Notes": "Layer F.SilkS" "Notes": "Layer F.Cu" "Notes": "Layers L1/L2" "Notes": "Layer F.Paste" "Notes": "Layer B.Cu" "Notes": "Layer F.Mask" "Notes": "Layer F.Cu" "Notes": "Layers L1/L2" "Notes": "Layer F.Mask" "Notes": "Layer B.Mask" "Notes": "Layer B.Cu" "Notes": "Layer F.Paste" "Notes": "Layer B.Mask" "Notes": "Layer F.Cu" "Notes": "Layers L1/L2" "Notes": "Layer F.Cu" "Notes": "Layers L1/L2" "Notes": "Layer F.Cu" "Notes": "Layers L1/L2" "Notes": "Layer F.Paste" "Notes": "Layer B.Paste" "Notes": "Layer B.SilkS" ; DRILL file {KiCad 7.0.11-7.0.11~ubuntu22.04.1} date Tue Mar 5 20:19:51 2024 Copper Layer Stackup: T5 15.200mm 0.5984" (1 hole) Total plated holes unplated through holes: ============================================================= 2d3c489f2acf0f8bdc9cf0fe8c2346d4d07472be More SR1 notation bacdac34d747275148c56e8293dc209c2e326fe4 c9e81f0cc630cea052574ce7c50b3e82145bb626 bacdac34d747275148c56e8293dc209c2e326fe4 744b72ef7e0d94fccfae99ec3cb3514981ac4616 Add simplest muscescore example d952ec97f3d5e1172c33dcefe438ee5d18f8d87d Start of LM13700 version to see why 53c90c58d8 move bugs to md file to be severed. [See this image of the Contributions of others (if any) used by this License. For legal entities, "You" includes any entity by asserting a patent license under Licensed Patents to make, have made, import, or transfer of either its Contributions conveyed by this License. 1.10. “Modifications” means any patent claim(s), including without limitation, damages for loss of use, data.