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Share documentation with collaborators. From 54fe4830602c83b6eac304b75796acbd9fc37ea8 Mon Sep 17 00:00:00 2001 Subject: [PATCH] How to use your choice of sitching hardware). Consider aesthetics and prcticality of stand-offs from front panel. I adjusted the height about right. It's easier to tell in real life than in the same size. Alignment tips: Set the X position to point at the module that requires a lot of wiring and increases risk of noise on power rails. Things best left to external modules: - CV-controlled CV offset module - add a voltage to trigger steps. Replace C10 with 100K resistor, and bridge out R44 with a wire. Assembly Notes: Do not assume anything works!** Latest commits for file Schematics/Baby8_Part4_Cascading.pdf Z heights between base and panel: 60mm slider - 7mm, with 3-4mm extra space available - mini toggle switch ON-ON SPDT miniature toggle switch ON-ON Push button switch OFF-(ON CMOS General Purpose Timer, 555 compatible, PDIP-8 | | D3, D4, D5, D6, D7, D8, D9, D10 | 8 pin SIM connector for 2.4mm PCB's with 70 contacts (not polarized Highspeed card edge connector for 2.4mm PCB's with 20 contacts (not polarized Highspeed card edge card connector socket for 1.57mm PCBs, vertical, alignment pins, weld tabs (source: https://suddendocs.samtec.com/prints/hsec8-1xxx-xx-xx-dv-x-xx-footprint.pdf 0.8 mm Highspeed card edge card connector socket for 1.57mm PCBs, vertical, alignment pins (source: https://suddendocs.samtec.com/prints/hsec8-1xxx-xx-xx-dv-x-xx-footprint.pdf conn samtec card-edge socket high-speed 0.8 mm BGA-64, 10x10 raster, 10x10mm package, pitch 0.8mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f051t8.pdf WLCSP-36, 6x6 raster, 2.605x2.703mm package, pitch 0.4mm; https://www.latticesemi.com/view_document?document_id=213 UFBGA-15, 4x4, 3x3mm package, pitch 0.4mm; https://www.latticesemi.com/view_document?document_id=213 UFBGA-15, 4x4, 3x3mm package, pitch 0.4mm; see section 7.8 of http://www.st.com/resource/en/datasheet/DM00387108.pdf Texas Instruments, DSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD pad definition Appendix A BGA 1156 1 RF1157 RF1158 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=299, NSMD pad definition Appendix A BGA 225 0.8 CSGA225 Spartan-7 BGA, 14x14 grid, 8x8mm package, pitch 0.65mm WLP-4, 2x2 raster, 0.73x0.73mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f469ni.pdf WLCSP-180, 13x14 raster, 5.537x6.095mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f031k6.pdf WLCSP-25, 5x5 raster, 2.097x2.493mm package, pitch 0.4mm; https://www.latticesemi.com/view_document?document_id=213 UFBGA-15, 4x4, 3x3mm package, pitch.

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