Labels Milestones
Back0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small-Outline Package.
- 2.409692e-04 vertex -9.030875e+01 1.001942e+02 4.255000e+01 facet.
- Pulse G L_Toroid, Vertical series, Radial, pin.