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44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=278, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=92, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double rows Through hole horizontal IDC header THT 1x06 2.54mm single row Through hole angled socket strip, 1x36, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 12.0mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole IDC header, 2x17, 2.54mm pitch, 6mm pin length, single row Through hole angled pin header THT 1x14 1.27mm single row style2 pin1 right Through hole straight socket strip, 2x25, 1.00mm pitch, 2.0mm pin length, double rows Surface mounted socket strip SMD 1x02 1.27mm single row Through hole angled socket strip, 2x21, 2.54mm pitch, DIN 41651 / IEC 60603-13.

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