Labels Milestones
BackSpacing 8.89 mm (350 mils), SMDSocket, LongPads 20-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils THT DIP DIL PDIP 2.54mm 7.62mm 300mil reed relay series, see https://standexelectronics.com/wp-content/uploads/datasheet_reed_relay_DIP.pdf DIL DIP PDIP 2.54mm 25.4mm 1000mil Socket 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 14-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 16-lead though-hole mounted high-volatge DIP package (based on http://www.latticesemi.com/view_document?document_id=213 Lattice caBGA-756, ECP5 FPGAs, 27.0x27.0mm, 756 Ball, 32x32 Layout, 0.8mm Pitch, http://www.latticesemi.com/view_document?document_id=213 Analog Devices (Linear Tech), 133-pin LGA uModule, 15.0x15.0x4.32mm, https://www.analog.com/media/en/technical-documentation/data-sheets/4637fc.pdf NXP LGA, 8.
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