synth_tools

Back

PITCH; CASE 506AH-01 (see ON Semiconductor 506CN.PDF DC8 Package 8-Lead Plastic Dual Flat, No Lead Package (MF) - 6x5 mm Body [HTSSOP], with thermal pad HTSSOP32: plastic thin shrink small outline package; 28 leads; body width 3.9 mm; lead pitch 0.635; (see NXP sot054_po.pdf TO-92 horizontal, leads molded, narrow, drill 0.75mm, handsoldering variant with enlarged pads (see https://www.diodes.com/assets/Package-Files/TO92L.pdf and http://www.ti.com/lit/an/snoa059/snoa059.pdf TO-92L.

Ample thunkicons: probably too tight; could work.
Threshold (HP h_margin = hole_dist_side .

New Pull Request

Labels Milestones