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Side 5a4e89eea6 Go to file main drumkit/Schematics/OttosIrresistableDance/KickDrum.kicad_sch 3660 lines main MK_VCO/Schematics/MK_VCO_RADIO_SHAEK_try2_ground_rail.diy 8102 lines E-Switch sub miniature slide switch, EG series, DPDT, http://spec_sheets.e-switch.com/specs/P040047.pdf E-Switch slide switch, vertical, SMT J bend https://dznh3ojzb2azq.cloudfront.net/products/Slide/JS/documents/datasheet.pdf MEC 5G single pole double throw, separate symbols K switch normally-closed pushbutton push-button Side push button (https://www.alps.com/prod/info/E/PDF/Tact/SurfaceMount/SKRT/SKRT.pdf push horizontal SPST 1P1T tactile switch http://www.ckswitches.com/media/1479/kmr2.pdf CK components KMR2 tactile switch SPST angled PTS645VL31-2 LFS tactile switch 6mm ALPS SKHH right angle right angle tactile switch 6mm ALPS SKHH right angle 3mm lightpipe dual tower right angle 3mm lightpipe dual tower right angle right angle USB3 type A right angle (https://www.we-online.com/katalog/datasheet/692122030100.pdf USB 3.0 type A right angle (http://www.molex.com/pdm_docs/sd/483930003_sd.pdf USB 3.0 type A right angle right angle USB type A, right angle, http://www.ckswitches.com/media/1428/os.pdf 1x-dip-switch SPST Copal_CHS-01A, Slide, row spacing 15.24 mm (600 mils), Socket 48-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils THT DIP DIL PDIP SMDIP 2.54mm 9.53mm 375mil 4-lead surface-mounted (SMD) DIP package, row spacing 8.9 mm (350 mils), SMDSocket, LongPads 64-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 6-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 12-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket 48-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 12x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil SMD 2x-dip-switch SPST CTS_Series194-2MSTN, Piano, row spacing 7.62 mm (300 mils 20-lead surface-mounted (SMD) DIP package, row spacing 24.13 mm (950 mils), SMDSocket, SmallPads 22-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf THT DIP DIL PDIP 2.54mm 7.62mm 300mil Three phase, Bridge, Rectifier, https://www.comchiptech.com/admin/files/product/SC35VB80S-G%20Thru506369.%20SC35VB160S-G%20RevB.pdf 4-lead dip package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline No-Lead 8-Lead Plastic Dual Flat, No Lead Package - 9x9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf TQFP, 144 Pin (http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131095), generated with kicad-footprint-generator Molex PicoBlade series connector, B8B-PH-SM4-TB (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole straight pin header, 2x09, 2.54mm pitch, single row Through hole angled pin header, 1x28, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Through.

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