3
1
Back

Sot54 PA33 diode SOD70 2-pin TO-92 horizontal, leads in-line, narrow, oval pads, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot519-1_po.pdf SSOP16: plastic shrink small outline package; 44 leads; body width 16.90 mm Power-Integrations variant of 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 20-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads THT DIP DIL ZIF 7.62mm 300mil LongPads 4-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 6.7x26.96mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 2x-dip-switch SPST Copal_CVS-02xB, Slide, row spacing 11.48 mm (451 mils SMD DIP Switch SPST.

New Pull Request