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1.6x0.8x0.8mm, "https://product.tdk.com/system/files/dam/doc/product/inductor/inductor/smd/catalog/inductor_commercial_decoupling_mlz1608_en.pdf" Inductor, TDK, MLZ2012_h1.25mm, 2.0x1.25x1.25mm, "https://product.tdk.com/system/files/dam/doc/product/inductor/inductor/smd/catalog/inductor_commercial_decoupling_mlz2012_en.pdf" Inductor,TDK, VLS-6045, 6x6x4.5mm, https://product.tdk.com/system/files/dam/doc/product/inductor/inductor/smd/catalog/inductor_commercial_power_vls6045ex_en.pdf inductor TDK VLP smd VLF10040 inductor TDK VLS SMD VLS6045EF VLS6045AF Tai Tech TMPC1265 SMD inductor Bourns SRU8028 series SMD inductor 8x8.15mm, https://www.bourns.com/docs/Product-Datasheets/SRN8040.pdf Bourns SRN8040 series SMD SMT SPST EVQPL EVQPT Coto Technologies SPST Reed Switch CT05-XXXX-J1 Coto Technologies SPST Reed Switch CT10-XXXX-G1 Coto Technologies SPST Reed Switch CT10-XXXX-G4 ALPS 5.2mm Square Low-profile Type (Surface Mount) SKQG Series, Without stem, http://www.alps.com/prod/info/E/HTML/Tact/SurfaceMount/SKQG/SKQGAEE010.html TL3305 Series Tact Switch with High Contact Reliability, Top-actuated Model, with Ground Terminal, with Boss Ultra-small-sized Tactile Switch with High Contact Reliability, Side-actuated Model, without Ground Terminal, without Boss Ultra-small-sized Tactile Switch SPST Slide 8.9mm 350mil SMD 2x-dip-switch SPST Copal_CHS-02B, Slide, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 24-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 12x-dip-switch SPST , Piano, row spacing 15.24 mm (600 mils 40-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 22-lead surface-mounted (SMD) DIP package, row spacing 11.48 mm (451 mils 14-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), see https://www.power.com/sites/default/files/product-docs/lnk520.pdf SMD DIP DIL ZIF 15.24mm 600mil Socket 3M 24-pin zero insertion force socket, through-hole, row spacing 7.62 mm (300 mils), missing pin 7 removed (Microchip Packaging Specification 00000049BS.pdf 8-Lead Plastic PSOP, Exposed Die Pad (see Microchip Packaging Specification 00000049BS.pdf UQFN, 20 Pin (JEDEC MO-153 Var DE https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator JST XA series connector, LY20-32P-DT1, 16 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ038187.pdf), generated with kicad-footprint-generator Inductor.

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