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1050mil SMDSocket LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 28-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 14-lead surface-mounted.

• 5/12-V-7.5-ZB 1719419 Evercom 5301-4P4C.
• Capacitors, power header, transistors, film caps, electrolytic.

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