Labels Milestones
BackPanel 82024e96c9 updated C14 footprint, traces, groundplane updated C14 footprint, traces, groundplane updated C14 footprint, traces, groundplane 2cbdb94ba9 updated C5 footprint & tracing; schematic annotation updates the potentiometer pads and trace routing to de-bodge the pots. Updates the potentiometer pads and thermal vias; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32l476me.pdf WLCSP-81, 9x9 raster, 3.639x3.971mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l152zd.pdf WLCSP-64, 8x8 raster, 3.357x3.657mm package, pitch 0.4mm; see section 7.7 of http://www.st.com/resource/en/datasheet/DM00330506.pdf WLCSP-100, 10x10 raster, 4.775x5.041mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f446ze.pdf WLCSP-81, 9x9 raster, 4.4084x3.7594mm package, pitch 0.4mm; see section 6.8 of http://www.st.com/resource/en/datasheet/stm32f746zg.pdf TFBGA-265, 17x17 raster, 14x14mm package, pitch 0.4mm.
- Quentin/Panels/POLYMORPH.png' 9bb3093b2bc14210884f0107e7a2898b2161266b Delete.
- Case 15.2x15.2mm, pitch 10.9mm, see https://www.fairchildsemi.com/package-drawings/TO/TO264A03.pdf TO-264-3.
- Envelope In The West" (bottom one) third iteration.