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HLE-127-02-xx-DV-PE-LC, 27 Pins per row (http://www.molex.com/pdm_docs/sd/1053101208_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py ON Semi DFN5 5x6mm 1.27P SO-8FL CASE 488A https://www.onsemi.com/pub/Collateral/488AA.PDF ON Semi DFN5 5x6mm 1.27P SO-8FL CASE 488A ON Semiconductor 122BX.PDF 32-Lead Plastic Thin Shrink Small Outline Package (MS) [MSOP] (see Microchip Packaging Specification 00000049BS.pdf QFN Microchip 8E 16 QFN, 44 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/2512S.pdf#page=17), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 22-27-2041, 4 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 16.

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