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Strip, HLE-113-02-xxx-DV-LC, 13 Pins per row (http://www.molex.com/pdm_docs/sd/460071105_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-150-02-xx-DV-TE, 50 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/), generated with kicad-footprint-generator ipc_plcc_jLead_generator.py PLCC, 84 pins, through hole M3, height 3.6, Wuerth electronics 97730506334 (https://katalog.we-online.com/em/datasheet/97730506334.pdf), generated with kicad-footprint-generator Molex PicoBlade Connector System, 43045-1600 (alternative finishes: 43045-080x), 4 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13C-10P-1.25V%2851%29/), generated with kicad-footprint-generator Molex Mini-Fit Sr. Power Connectors, 105310-xx12, 6 Pins per row (http://www.molex.com/pdm_docs/sd/460071105_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-112-02-xx-DV-TE, 12 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/), generated with kicad-footprint-generator ipc_noLead_generator.py 44-Lead Plastic Quad Flat, No Lead Package (JQ) - 4x4x0.5 mm Body [QFN] with thermal vias and counter-pad, see http://www.ti.com/lit/ds/symlink/tps62177.pdf WSON-10 package 2x3mm body, pitch 0.5mm, see http://www.ti.com/lit/ds/symlink/tps62177.pdf WSON 0.5 thermal vias in pads, 5 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, old mpn/engineering number: 1-770190-x, 5 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 8-Lead Plastic PSOP, Exposed Die Pad (see Microchip Packaging Specification 00000049BS.pdf, http://www.onsemi.com/pub/Collateral/NCP1207B.PDF 8-Lead Plastic DFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic Shrink Small Outline (SN) - Narrow, 3.90 mm Body [SSOP] (http://cds.linear.com/docs/en/datasheet/680313fa.pdf SSOP, 48 Pin (http://www.ti.com/lit/ds/symlink/cc1312r.pdf#page=48), generated with kicad-footprint-generator JST PH series connector, 202396-0507 (http://www.molex.com/pdm_docs/sd/2023960207_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-130-02-xx-DV-TE, 30 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 55560-0501, 50 Pins per row (https://www.molex.com/pdm_docs/sd/022057045_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SOIC, 20 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=274), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 4 times 1.5 mm² wires, basic insulation, conductor diameter 1.25mm, outer diameter 1.7mm, size source.

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