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Http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 5.08mm 7.62mm 300mil Socket 4-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 18-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils 40-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils THT DIP DIL ZIF 25.4mm 1000mil Socket.

• 4.18518 7.89166 facet normal 0.995185 -0.0980148 -3.67514e-06.
• 3.255004e-04 facet normal 9.575356e-16 -1.000000e+00.
• Ball grid, ST die ID 468.
• Vertex -1.082601e+02 9.695134e+01 1.271621e+01 facet normal 9.969322e-01 -7.826654e-02.

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