3
1
Back

8826 10-Lead Plastic Dual Flat, No Lead Package - 3x3 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 8-Lead Plastic DFN (5mm x 4mm) (see Linear Technology DFN_8_05-08-1702.pdf 8-Lead Plastic Dual Flat, No Lead Package (MC) - 2x3x0.9 mm Body [VDFN] (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Shrink Small Outline (SN) - Narrow, 3.90 mm Body [QFN] with thermal vias in pads, 6 Pins (http://www.molex.com/pdm_docs/sd/903250004_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py WDFN, 10 Pin (https://www.ti.com/lit/ds/symlink/bq24090.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py LFCSP, 32 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation EB), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 32 Pin (https://www.exar.com/ds/mxl7704.pdf#page=35), generated with kicad-footprint-generator Molex Molex 0.30mm.

New Pull Request