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1
Back

SOIC Pitch 1.27 SSOP-8 2.9 x2.8mm Pitch 0.65mm Slug Up (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/tda7266d.pdf, www.st.com/resource/en/application_note/cd00003801.pdf HSOP, 32 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_32_05-08-1693.pdf), generated with kicad-footprint-generator connector Molex Micro-Fit_3.0 side entry Molex MicroClasp Wire-to-Board System, 55935-1130, 11 Pins (http://www.molex.com/pdm_docs/sd/559350530_sd.pdf), generated with kicad-footprint-generator.

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