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8pin thermal pad TQFP64 7x7, 0.4P CASE 932BH (see ON Semiconductor 506AF.PDF DKD Package; 24-Lead Plastic Shrink Small Outline (SN) - Narrow, 3.90 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf UQFN, 16 Pin (JEDEC MO-153 Var HC https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator JST XA series.

0.466839 -0.877362 0.110891 facet normal -6.586177e-001 -2.932776e-003 7.524720e-001.
Header 2x25 2.54mm double row Through hole pin.
18 top-side contacts, 0.5mm.
-0.587092 0.808201 facet normal 9.867236e-01.

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