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Pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=303, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole socket strip SMD 2x40 1.27mm double row Through hole straight pin header, 2x01, 2.54mm pitch, double rows Through hole angled socket strip THT 2x21 1.00mm double row surface-mounted straight socket strip, 1x10, 2.54mm pitch, 6mm pin length, single row Surface mounted pin header SMD 2x08 2.54mm double row surface-mounted straight socket strip, 1x17, 1.00mm pitch, 2.0mm pin length, single row style1 pin1 left Surface mounted pin header THT 2x33 1.00mm double row surface-mounted straight pin header, 1x18, 2.00mm pitch, double rows Surface mounted pin header THT 1x31 1.27mm single row style1 pin1 left Surface mounted pin header SMD 1x35 1.27mm single row Through hole angled pin header, 2x21, 1.00mm pitch, 2.0mm pin length, double rows Surface mounted pin header SMD 1x36 2.54mm single row Through hole straight pin header, 2x40, 2.00mm pitch, single row Through hole straight socket strip, 2x25, 1.00mm pitch, single row Through hole.

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