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Wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g031y8.pdf ST WLCSP-20, ST die ID 482, 4.2x3.95mm, 90 Ball, X-staggered 21x11 Layout, 0.4mm.

Http://www.latticesemi.com/view_document?document_id=213 WLCSP-16 2.225x2.17mm, 2.17x2.225mm, 16.
[right_col, row_2, 0]; triangle_out = [width_mm-h_margin-working_width/4.
Vertex 1.11009 -2.67999 18.9335 facet normal.
-1.058603e+02 9.725134e+01 1.028697e+01 facet normal.

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