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16-pin module, column spacing 22.86 mm (900 mils), SMDSocket, SmallPads 42-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 10-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 8-lead surface-mounted (SMD) DIP package, row spacing 11.43 mm (450 mils), SMDSocket.

• -8.452844e-01 0.000000e+00 5.343166e-01 facet.
• -3.131999e-003 6.715497e-001 vertex 5.121105e+000.

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