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Pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=260, NSMD pad definition Appendix A Kintex-7 and Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=301, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments DSBGA BGA YFF S-XBGA-N5 Texas Instruments, DSBGA, area grid, YBG pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb15cc.pdf#page=119 ST WLCSP-52, ST die ID 471, 4.437x4.456mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g051f8.pdf#page=102 ST WLCSP-25, ST die ID 467, 3.09x3.15mm, 52 Ball, X-staggered 21x11 Layout, 0.4mm Pitch, https://assets.nexperia.com/documents/data-sheet/PCMFXUSB3S_SER.pdf ST WLCSP-18, ST Die ID 466, 1.86x2.14mm, 18 Ball, X-staggered 18x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l496wg.pdf ST WLCSP-132, ST die ID 480, 4.57x4.37mm, 132 Ball, 12x11 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h7a3ai.pdf ST WLCSP-156, ST die ID 471, 4.437x4.456mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, http://www.st.com/content/ccc/resource/technical/document/technical_note/92/30/3c/a1/4c/bb/43/6f/DM00103228.pdf/files/DM00103228.pdf/jcr:content/translations/en.DM00103228.pdf pSemi CSP-16 1.64x2.04x0.285mm (http://www.psemi.com/pdf/datasheets/pe29101ds.pdf, http://www.psemi.com/pdf/app_notes/an77.pdf UFD Package, 4-Lead Plastic QFN (3mm x 3mm) (see Linear Technology DFN_8_05-08-1702.pdf 8-Lead Plastic DFN (3mm x 2mm) (see Linear Technology DFN_24_05-08-1864.pdf DKD Package; 32-Lead Plastic Thin Shrink Small Outline (SS)-5.30 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 24 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot158-1_po.pdf VSO56: plastic very small outline package; 8 leads; body width 3.9 mm; lead pitch 0.635; (see NXP sot054_po.pdf TO-126-2, Horizontal, RM 2.54mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-2 Vertical RM 2.54mm TO-220-4, Vertical, RM 1.7mm, Pentawatt, Multiwatt-5, staggered type-1, see http://www.st.com/resource/en/datasheet/l298.pdf TO-220-15 Horizontal RM 5.45mm TO-3PB-3, Vertical, RM 1.7mm, PentawattF-, MultiwattF-5 TO-220F-5 Vertical RM 10.95mm SOT-93 TO-218-3, Horizontal, RM 5.45mm, see https://www.fairchildsemi.com/package-drawings/TO/TO264A03.pdf TO-264-3 Vertical RM 10.9mm TO-264-3, Horizontal, RM 0.97mm, Multiwatt-9, staggered type-2 TO-220-5, Horizontal, RM 2.29mm, IPAK, see https://www.diodes.com/assets/Package-Files/TO251.pdf TO-251-3 Horizontal RM 2.54mm TO-220-5, Horizontal, RM 1.7mm, Pentawatt, Multiwatt-5, staggered type-1, see https://www.njr.com/semicon/PDF/package/TO-220F-4_E.pdf TO-220F-4 Vertical RM 1.7mm Pentawatt Multiwatt-5 staggered type-1 TO-220-5, Horizontal, RM 10.95mm, SOT-93, see https://www.vishay.com/docs/95214/fto218.pdf TO-218-2 Vertical RM 2.54mm TO-220F-3, Vertical, RM 2.29mm, IPAK, see https://www.diodes.com/assets/Package-Files/TO251.pdf TO-251-2 Horizontal RM 5.475mm SOT-93 TO-220-2, Horizontal, RM 1.27mm, staggered type-2, see http://www.st.com/resource/en/datasheet/l298.pdf.

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