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Pad as test point, loop diameter 2.5mm, see http://www.metz-connect.com/de/system/files/productfiles/Datenblatt_311011_RT016xxHBWC_OFF-022771S.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_MetzConnect THT terminal block Metz Connect Type101_RT01603HBWC pitch 5.08mm size 76.2x9.8mm^2 drill 1.3mm pad 2.5mm terminal block RND 205-00238, 8 pins, pitch 5mm, size 30x12.5mm^2, drill diamater 1.3mm, pad diameter 2.4mm, outer diameter 2.7mm, size source Multi-Contact FLEXI-E 0.15 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: AE-6410-10A example for new mpn: 39-28-x06x, 3 Pins (http://www.molex.com/pdm_docs/sd/559320210_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py Analog LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/cp-16-40.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 6 times 0.1 mm² wires, reinforced insulation, conductor diameter 2.4mm, outer diameter 4.4mm, size source Multi-Contact FLEXI-xV 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator JST EH series connector, SM08B-SHLS-TF (http://www.jst-mfg.com/product/pdf/eng/eSHL.pdf), generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On BackFlip Type FFC/FPC, 502250-2391, 23 Circuits (http://www.molex.com/pdm_docs/sd/5022502391_sd.pdf), generated with kicad-footprint-generator Molex LY 20 series connector, 504050-0691 (http://www.molex.com/pdm_docs/sd/5040500891_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 20 Pin (JEDEC MS-013AE, https://www.analog.com/media/en/package-pcb-resources/package/35833120341221rw_28.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: AE-6410-12A example for new mpn: 39-28-x12x, 6 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Molex KK-254 Interconnect System, old/engineering part number: AE-6410-04A example for new mpn: 39-28-904x, 2 Pins (https://www.molex.com/pdm_docs/sd/009652028_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py VQFN, 48 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/48L_VQFN_6x6mm_6LX_C04-00494a.pdf), generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Straight solder pin 1 x.

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