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Semiconductor 506AF.PDF DKD Package; 32-Lead Plastic Thin Shrink Small-Outline Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments HSOP 9, 1.27mm pitch, single row Surface mounted socket strip THT 1x02 1.00mm single row style2 pin1 right Through hole pin header THT 2x34 2.54mm double row Through hole angled socket strip SMD 1x28 2.00mm single row Through hole angled socket strip SMD 1x40 1.00mm single row Through hole angled socket strip, 2x12, 1.27mm pitch, double rows Through hole angled socket strip, 2x13, 1.27mm.

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