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BackOn Tue Mar 5 20:19:51 2024 Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes are merged with plated holes Total unplated holes count 16 Not plated through holes are merged with plated holes count 16 Not plated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) T5 15.200mm 0.5984" (1 hole) T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes) T5 15.200mm 0.5984" (1 hole T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes T5 15.200mm 0.5984" (1 hole T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes) (with 4 slots T2 5.000mm 0.1969" (1 hole) T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes) T5 15.200mm 0.5984" (1 hole Total plated holes count 16 Not plated through holes: merged pull request 'Put title box in PDF export' (#4) from schematic by Eeschema 5.1.10-88a1d61d58~90~ubuntu20.04.1 **Component Count:** 76 | Refs | Qty | Component | Description | Manufacturer | Part | Vendor | SKU | | S1 | 1 | LM358 | Low-Power, Dual Operational Amplifiers, DIP-8/SOIC-8/TO-99-8 Samba_Reggae_1.html Normal file Unescape Hardware/PCB/precadsr/ao_symbols.lib Normal file Unescape Panels/10_step_seq_38hp_v3.scad Normal file View.
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