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42819-52XX, With thermal vias in pads, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 64-Lead Plastic Quad Flat, No Lead Package (ML) - 8x8x0.9 mm Body [SOIC] (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf.

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