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Small outline package; 28 leads; body width 16.90 mm Power-Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 25.4 mm (1000 mils), Socket 20-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads 14-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads.

• 5.142266e-001 1.931329e-003 8.576522e-001 facet normal 0.464833 -0.31635 -0.826954.
• 26 .../precadsr-panel-MaskBottom.gbs | 75 .../precadsr-panel-MaskTop.gts .
• -9.718411e+01 1.060913e+02 2.550000e+00 facet normal 5.011261e-001.

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