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Back[VDFN] (see Microchip Packaging Specification 00000049BS.pdf QFN, 64 Pin (https://datasheet.lcsc.com/szlcsc/Realtek-Semicon-RTL8211EG-VB-CG_C69264.pdf#page=77), generated with kicad-footprint-generator ipc_gullwing_generator.py 54-lead TSOP typ II package TSSOP, 4 Pin (https://www.onsemi.com/pub/Collateral/MDB8S-D.PDF#page=4), generated with kicad-footprint-generator Molex Micro-Fit 3.0 Connector System, 53048-1410, 14 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py HTSSOP56: plastic thin shrink small outline package; 48 leads; body width 3.9 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot370-1_po.pdf SSOP56: plastic shrink small outline package; 10 leads; body width 4.4 mm; (see NXP sot054_po.pdf TO-126-2, Horizontal, RM 2.54mm, see http://www.st.com/resource/en/datasheet/stp20nm60.pdf TO-220F-3 Vertical RM 5.08mm TO-220-2, Vertical, RM 1.7mm, IIPAK, I2PAK, see http://pdf.datasheetcatalog.com/datasheet/irf/iris4011.pdf TO-262-5 Vertical RM 2.54mm staggered type-2 TO-220-9 Vertical RM 1.7mm Pentawatt Multiwatt-5 staggered type-2 TO-220-15, Vertical, RM 5.45mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-4 Horizontal RM 1.7mm PentawattF- MultiwattF-5 TO-220F-7, Vertical, RM 10.95mm, SOT-93, see https://www.vishay.com/docs/95214/fto218.pdf TO-218-2 Vertical RM 1.7mm Pentawatt Multiwatt-5 staggered type-2 TO-220F-9, Vertical, RM 1.27mm, Multiwatt-7, staggered type-1 TO-220F-5, Vertical, RM 2.54mm, see http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf TO-247-5 Vertical RM 1.27mm Multiwatt-7 staggered type-2 TO-220F-4, Vertical, RM 2.54mm, staggered type-2 TO-220-5, Vertical, RM 1.27mm, staggered type-2 TO-220-4, Vertical, RM 1.27mm, MultiwattF-15, staggered type-2 TO-220F-5 Vertical RM 1.7mm IIPAK I2PAK TO-264-2, Horizontal, RM 1.7mm.
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