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FE Package; 16-Lead Plastic TSSOP (4.4mm); Exposed Pad Variation BB; (see Linear Technology DFN_16_05-08-1732.pdf DHC Package; 16-Lead Plastic Shrink Small Outline (SS)-5.30 mm Body [LFCSP], (see http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_20_6.pdf LFCSP, 20 Pin (JEDEC MO-153 Var BC https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator connector JST J2100 vertical JST ZE series connector, 53780-0670 .

• Add '3D Printing/Panels/AD&D 1e spell.
• Jack col_right = width_mm.
• -1.25272 0.048847 facet normal.

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