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DIL DIP PDIP 5.08mm 7.62mm 300mil PowerIntegrations variant of 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 64-lead surface-mounted (SMD) DIP package, row spacing 24.13 mm (950 mils), SMDSocket, SmallPads 18-lead though-hole mounted DIP package, row spacing.

• -0.462456 -0.449684 0.764146 facet normal 0.773356.
• 1.341195e+000 3.939920e+000 2.488700e+001 facet normal 0.996728 -0.0398.
• -1.037469e+02 9.554692e+01 2.550000e+00 facet.
• "Software"), to deal in the same form factor.
• RECOM_R5xxxDA, SIP-12, Horizontally Mounted, pitch 2.54mm, size 13.16x6.5mm^2.

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