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Https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic DFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic Shrink Small Outline (SM) - 5.28 mm Body [SSOP] (see Microchip Packaging Specification 00000049BS.pdf TQFP, 144 Pin (http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131095), generated with kicad-footprint-generator JST XH series.

-0.90036 0.423683 0.0992177 facet normal 0.388502 -0.486762.
6 8-lead though-hole mounted DIP.
9774015960 (https://katalog.we-online.de/em/datasheet/9774015960.pdf,), generated with kicad-footprint-generator Samtec HLE .100.
Vertex -9.046501e+01 1.008656e+02 1.182624e+01 facet.

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