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[TQFP] With 4.5x4.5 mm Exposed Pad Variation BB; (see Linear Technology DFN_18_05-08-1778.pdf DFN20, 6x5, 0.5P; CASE 505AB (see ON Semiconductor 506CE.PDF DD Package; 8-Lead Plastic Dual Flat, No Lead Package, 1.2x1.8x1.55 mm Body [SSOP] (see Microchip Packaging Specification 00000049BS.pdf DFN.

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