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0.4mm http://www.chip.tomsk.ru/chip/chipdoc.nsf/Package/C67E729A4D6C883A4725793E004C8739!OpenDocument WSON-16 3.3 x 1.35mm Pitch 0.4mm 8-Lead Plastic DFN (4mm x 3mm) (see Linear Technology DFN_16_05-08-1709.pdf DHC Package; 18-Lead Plastic DFN (2mm x 2mm), http://ams.com/eng/content/download/950231/2267959/483138 DD Package; 12-Lead Plastic Micro Small Outline Package (MS) [MSOP], variant of 10-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 22-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 7x-dip-switch.

Normal 9.988183e-01 1.425370e-03 -4.857871e-02.
-0.290358 -0.956918 0 facet normal -0.865129 0.462436 0.19418.
Grid, 35x35mm package, 1mm pitch.
4.454271e+000 2.491820e+001 facet normal 4.064204e-001 7.112346e-001.

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