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AVX Kyocera, LMLP Series, style D, 6.6mmx7.3mm, 3.0mm height. (Script generated with kicad-footprint-generator Molex Sabre Power Connector, 43160-1106, With thermal vias in pads, 3 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact FFC/FPC, 200528-0300, 30 Circuits (https://www.molex.com/pdm_docs/sd/2005280300_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 28 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0140.PDF (T4055-1)), generated with kicad-footprint-generator ipc_noLead_generator.py TQFN, 32 Pin (http://www.thatcorp.com/datashts/THAT_5171_Datasheet.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py DD Package; 8-Lead Plastic Dual Flat, No Lead Package - 3x3 mm Body [QFN] with thermal vias; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf 20-Lead Plastic Shrink Small Outline Narrow Body (QR)-.150" Body [QSOP] (see Microchip Packaging Specification 00000049BS.pdf DFN, 6 Pin (https://www.diodes.com/assets/Package-Files/U-DFN2018-6.pdf), generated with kicad-footprint-generator JST GH series connector, 502382-1470 (http://www.molex.com/pdm_docs/sd/5023820270_sd.pdf), generated with kicad-footprint-generator Molex Sabre Power Connector, 46007-1104, With thermal vias in pads.

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