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43160-0102, With thermal vias in pads, 6 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13C-10P-1.25V%2851%29/), generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Angled solder pin 1 x 1 mm, 734-164 , 4 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator Hirose DF11 through hole, DF11-10DP-2DSA, 5 Pins per row.

Size 30x7.6mm^2 drill 1.3mm pad 2.5mm terminal block.
And successors. We intend this.

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