Labels Milestones
BackG5Q, http://omronfs.omron.com/en_US/ecb/products/pdf/en-g5q.pdf Relay SPDT Potter&Brumfield T9AP5D52 12V 30A 1xUn Connector Fast ON Flachsteckeranschluss Only Dummy for Space NO Pads Relau SPST Potter&Brumfield T9AP1D52 12V 30A 1xEin Connector Fast ON Flachsteckeranschluss Only Dummy for Space NO Pads Relau SPST Potter&Brumfield T9AP1D52 12V 30A 1xEin Connector Fast ON Only Dummy for Space NO Pads Relay SPDT Potter&Brumfield T9AP5D52 12V 30A 1xUn Connector Fast ON Only Dummy for Space NO Pads Relay SPDT Finder 40.11, https://www.finder-relais.net/de/finder-relais-serie-40.pdf Relay DPDT Finder 96.12 56.32 package for diode bridges, row spacing 7.62 mm (300 mils THT DIP DIL PDIP 2.54mm 7.62mm 300mil 3-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf Power Integrations eDIP-12B, see https://www.power.com/sites/default/files/product-docs/linkswitch-pl_family_datasheet.pdf 4-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils 18-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), SMDSocket, LongPads 20-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 8x-dip-switch SPST KingTek_DSHP08TJ, Slide, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 22.86mm 900mil SMDSocket SmallPads 40-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 24-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 9x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 10-lead surface-mounted (SMD) DIP package, row spacing 24.13 mm (950 mils), SMDSocket, LongPads 5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 6-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, LongPads 5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 10-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), SMDSocket.
- Push-push (https://www.hirose.com/product/document?clcode=CL0609-0004-8-82&productname=DM1AA-SF-PEJ(82)&series=DM1&documenttype=2DDrawing&lang=en&documentid=0000915301 Hirose FH41, FFC/FPC.
- UFBGA-121, 6.0x6.0mm, 121 Ball, 11x11 Layout, 0.5mm Pitch.