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(http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, BGA Microstar Junior, 5x5mm, 80 ball 9x9 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double cols (from Kicad 4.0.7), script generated Through hole socket strip THT 2x21 1.00mm double row Through hole IDC header, 2x25, 2.00mm pitch, single row Through hole pin header SMD 2x32 1.27mm double row SMD IDC box header THT 1x09 1.27mm single row (from Kicad 4.0.7), script generated Through hole angled socket strip, 2x35, 1.00mm pitch, single row male, vertical entry Harwin LTek Connector, 2 pins, http://cdn-reichelt.de/documents/datenblatt/A500/LED8MMGE_LED8MMGN_LED8MMRT%23KIN.pdf LED diameter 4.0mm Plated Hole as test Point, diameter 3.0mm, 3 pins, pitch 5mm, size 45x9mm^2, drill diamater 1.1mm, pad diameter 2.6mm, see http://www.4uconnector.com/online/object/4udrawing/10702.pdf, script-generated with , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_WAGO THT Terminal Block WAGO.

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