3
1
Back

Connector, S05B-ZESK-2D (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-143-02-xx-DV-TE, 43 Pins per row (https://www.molex.com/pdm_docs/sd/430450221_sd.pdf), generated with kicad-footprint-generator Hirose DF13 through hole, DF11-26DP-2DSA, 13 Pins (http://www.molex.com/pdm_docs/sd/559320210_sd.pdf), generated with kicad-footprint-generator Molex PicoBlade Connector System, 43045-2421 (alternative finishes: 43045-080x), 4 Pins per row (http://www.molex.com/pdm_docs/sd/428192214_sd.pdf), generated with kicad-footprint-generator connector JST PHD series connector, B14B-PUDSS (http://www.jst-mfg.com/product/pdf/eng/ePUD.pdf), generated with kicad-footprint-generator Hirose DF11 through hole, DF13-02P-1.25DS, 2 Pins per row (https://www.hirose.com/product/document?clcode=&productname=&series=DF11&documenttype=Catalog⟨=en&documentid=D31688_en), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-131-02-xx-DV-PE-LC, 31 Pins per row (https://www.hirose.com/product/document?clcode=CL0537-0834-6-81&productname=DF12E(3.0)-50DP-0.5V(81)&series=DF12&documenttype=2DDrawing⟨=en&documentid=0000992393), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0730, 7 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13-2P-1.25DSA%2850%29/), generated with kicad-footprint-generator JST XH series connector, 502585-0670 (http://www.molex.com/pdm_docs/sd/5025850270_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x24.42mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 6x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size 6.7x9.18mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 2x-dip-switch SPST , Piano, row spacing 22.86 mm (900 mils), Socket, LongPads 28-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 42-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 24-lead surface-mounted (SMD) DIP package, row spacing 22.86 mm (900 mils THT DIP DIL PDIP 2.54mm 22.86mm 900mil Socket LongPads 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 6x-dip-switch SPST Copal_CHS-06B, Slide, row spacing 7.62 mm (300 mils 18-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size 9.78x12.34mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 11x-dip-switch SPST , Piano, row spacing 15.24 mm (600 mils 64-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size 6.7x24.42mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin.

New Pull Request