3
1
Back

2.54mm 11.43mm 450mil SMDSocket LongPads 64-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 20-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 8-Lead, 300\" Wide, Surface Mount Double Row 2.54mm (0.1 inch) Pitch PCB.

New Pull Request