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Pitch (http://www.st.com/resource/en/datasheet/tda7264.pdf TO-220-9 Vertical RM 3.81mm TO-264-5, Vertical, RM 1.27mm, Multiwatt-7, staggered type-2 TO-220-15, Vertical, RM 0.9mm, staggered type-2 TO-220F-5 Vertical RM 5.45mm TO-3PB-3, Vertical, RM 5.45mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-3 Vertical RM 1.7mm staggered type-1 TO-220-5, Horizontal, RM 1.7mm, PentawattF-, MultiwattF-5 TO-220F-5 Vertical RM 2.54mm TO-220F-3, Vertical, RM 1.27mm, MultiwattF-15, staggered type-1 TO-220-9 Vertical RM 2.54mm TO-220F-3, Vertical, RM 5.08mm, see https://www.centralsemi.com/PDFS/CASE/TO-220-2PD.PDF TO-220-2 Horizontal RM 2.29mm IPAK TO-251-3, Horizontal, RM 0.97mm, Multiwatt-9, staggered type-2 TO-220-9, Vertical, RM 1.27mm, Multiwatt-7, staggered type-1 TO-220-7, Horizontal, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 2.54mm 7.62mm 300mil Socket 3M 24-pin zero insertion force socket, through-hole, row spacing 15.24 mm (600 mils), LongPads 42-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 16-lead though-hole mounted DIP package, row spacing 25.24 mm (993 mils SMD DIP Switch SPST Slide 7.62mm 300mil LongPads 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 18-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils THT DIP DIL ZIF 7.62mm 300mil LowProfile 1x-dip-switch SPST Copal_CVS-01xB, Slide, row spacing 15.24 mm (600 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf THT DIP DIL PDIP 2.54mm 25.4mm 1000mil Socket 40-lead though-hole mounted DIP package, row spacing 5.9 mm (232 mils), body size 9.78x19.96mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 11x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body.

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