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With Exposed Pad Variation BB; (see Linear Technology DFN_16_05-08-1732.pdf DHC Package; 16-Lead Plastic DFN (3mm x 2mm) (see Linear Technology 05081707_A_DHD16.pdf DH Package; 16-Lead Plastic HTSSOP (4.4x5x1.2mm); Thermal pad; (http://www.ti.com/lit/ds/symlink/drv8833.pdf HTSSOP, 16 Pin (https://www.nxp.com/docs/en/package-information/SOT109-1.pdf), generated with kicad-footprint-generator connector Molex KK-396 vertical Molex KK 396 Interconnect System, old/engineering part number: A-41791-0014 example for new part number: 26-60-4150, 15 Pins (http://www.molex.com/pdm_docs/sd/559350530_sd.pdf), generated with kicad-footprint-generator Connector Phoenix Contact, SPT 2.5/8-H-5.0-EX 1732441 Connector Phoenix Contact connector.

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