3
1
Back

10x8.1mm^2, drill diamater 1.2mm, pad diameter 2.6mm, see http://www.mouser.com/ds/2/324/ItemDetail_1935161-922578.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_Phoenix THT Terminal Block Phoenix MKDS-1,5-10 pitch 5mm size 62.3x14mm^2 drill 1.15mm pad 3mm Terminal Block Phoenix MKDS-1,5-12-5.08 pitch 5.08mm length 13mm width 6.5mm Capacitor C, Rect series, Radial, pin pitch=15.00mm, , length*width=18*7mm^2, Capacitor, http://www.wima.com/EN/WIMA_FKS_3.pdf C Rect series Radial pin pitch 5.00mm length 7.2mm width 3.0mm solder Pin_ diameter 1.0mm, wire diameter 1.0mm wire loop as test point, loop diameter2.6mm, hole diameter 1.3mm, length 10.0mm, width 3.5mm, e.g. Ettinger 13.13.890, https://katalog.ettinger.de/#p=434 Through hole angled socket strip SMD 1x38 1.00mm single row style2 pin1 right Through hole angled socket strip SMD 2x03 2.54mm double row Through hole IDC header, 2x13, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Surface mounted socket strip THT 2x17 2.54mm double row Through hole angled pin header THT 2x20 2.54mm double row Through hole angled pin header, 2x26, 1.00mm pitch, 2.0mm pin length, single row style1 pin1 left Surface mounted pin header THT 1x33 1.00mm single row Through hole straight pin header, 1x33, 2.54mm pitch, single row Surface mounted socket strip SMD 2x40 2.54mm double row surface-mounted straight pin header, 2x06, 2.54mm pitch, 6mm pin length, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 2x35, 1.27mm pitch, 3.9x4.9mm body, exposed pad, 7x7mm body (http://www.analog.com/media/en/technical-documentation/data-sheets/AD7951.pdf, http://www.analog.com/en/design-center/packaging-quality-symbols-footprints/symbols-and-footprints/AD7951.html LFCSP-WD, 8 Pin (http://www.ti.com/lit/ds/symlink/iso1050.pdf), generated with kicad-footprint-generator JST XH series connector, B9P-VH-FB-B, shrouded (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Infineon, PG-TISON-8-2, 5x6x1.15mm, 1.27mm Pitch, Exposed Paddle, https://www.infineon.com/cms/en/product/packages/PG-TISON/PG-TISON-8-2/ Infineon, PG-TISON-8-4, 5x6x1.15mm, 1.27mm Pitch, Exposed Paddle, https://www.infineon.com/cms/en/product/packages/PG-TISON/PG-TISON-8-4/ Infineon, PG-TISON-8-5, 8x8x1.1mm, 1mm Pitch, https://www.infineon.com/cms/en/product/packages/PG-TISON/PG-TISON-8-5/ VML0806, Rohm (http://rohmfs.rohm.com/en/techdata_basic/transistor/soldering_condition/VML0806_Soldering_Condition.pdf, http://rohmfs.rohm.com/en/products/databook/package/spec/discrete/vml0806_tr-e.pdf MicroCrystal C3 2.5x3.7mm, https://www.microcrystal.com/fileadmin/Media/Products/RTC/Datasheet/RV-1805-C3.pdf SON, 8 Pin (https://docs.broadcom.com/docs/AV02-4755EN), generated with kicad-footprint-generator ipc_noLead_generator.py 16-Lead Ultra Thin Plastic Quad Flat, No Lead Package (MF) - 3x3x0.9 mm Body [DFN-S] (see Microchip Packaging Specification 00000049BS.pdf 8-Lead Plastic Dual Flat, No Lead Package (UC) - 3x3x0.5 mm Body [QFN]; see section 48.2.4 of http://ww1.microchip.com/downloads/en/DeviceDoc/DS60001479B.pdf WLCSP-81, 9x9, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l562ce.pdf ST WLCSP-90, ST die ID 472, 4.36x4.07mm, 81 Ball, 9x9 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g483me.pdf ST WLCSP-81, ST die ID 482, 4.2x3.95mm, 90 Ball, X-staggered.

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